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Polished Wafers

Polished Wafers

Polished wafers are produced from FZ,CZ,or MCZ silicon ingots. These wafers achieve near-perfect surfaces that meet the highest standards for flatness and surface quality through cutting, lapping, polishing, and other processes. Depending on the dopant concentration, polished wafers are classified as either lightly doped or heavily doped.

Epitaxial Wafers

Epitaxial Wafers

Epitaxial wafers are polished wafers with one or more additional layers through epitaxy. These layers have specific dopant types, resistivity, thickness, and lattice structures.

Argon-Annealed Wafers

Argon-Annealed Wafers

Argon-annealed wafers are polished wafers that have been annealed (treated with heat) in an argon environment to produce a clean surface layer. The annealing process helps to remove impurities and eliminate surface defects, thereby enhancing device performance.

Other Products

Other Products

Lapped silicon wafers can be transformed into polished epitaxial wafers through polishing and other precision processes. Etched silicon wafers are produced through mixed acid etching, which removes the stress-damaged layer from the surface to maintain high-quality monocrystalline characteristics.

Polished Wafers

Polished wafers are produced from FZ,CZ,or MCZ silicon ingots. These wafers achieve near-perfect surfaces that meet the highest standards for flatness and surface quality through cutting, lapping, polishing, and other processes. Depending on the dopant concentration, polished wafers are classified as either lightly doped or heavily doped.

Epitaxial Wafers

Epitaxial wafers are polished wafers with one or more additional layers through epitaxy. These layers have specific dopant types, resistivity, thickness, and lattice structures.

Argon-Annealed Wafers

Argon-annealed wafers are polished wafers that have been annealed (treated with heat) in an argon environment to produce a clean surface layer. The annealing process helps to remove impurities and eliminate surface defects, thereby enhancing device performance.

Other Products

Lapped silicon wafers can be transformed into polished epitaxial wafers through polishing and other precision processes. Etched silicon wafers are produced through mixed acid etching, which removes the stress-damaged layer from the surface to maintain high-quality monocrystalline characteristics.

Polished Wafers
Epitaxial Wafers
Argon-Annealed Wafers
Other Products

Wafer Type Selection

Polished Wafers

Epitaxial Wafers

Argon-Annealed Wafers

Other Products

Product Specifications

Product Size Process Orientation Conductivity Type
300mm     MCZ/CZ

<100>

<110>

<111>

 N,P

 

Product Size Process Orientation Conductivity Type
200mm     MCZ/CZ

<100>

<111>

 N,P
FZ

 

Product Size Process Orientation Conductivity Type
≤150mm CZ/FZ

<100>

<111>

 N,P

 

Product Size Process Orientation Conductivity Type
300mm MCZ/CZ

<110>

<100>

 N,P

 

Product Size Process Orientation Conductivity Type
200mm MCZ/CZ

<100>

<111>

 N,P

 

Product Size Process Orientation Conductivity Type
≤150mm CZ

<100>

<111>

 N,P
Product Size Process Orientation Conductivity Type
300mm MCZ

<100>

 P

 

Product Size Process Orientation Conductivity Type
200mm MCZ/CZ

<100>

 P
Lapped Wafers Product Size Process Orientation Conductivity Type
≤150mm CZ/FZ

<100>

<111>

 N,P

 

Etched Wafers Product Size Process Orientation Conductivity Type
≤150mm CZ/FZ

<100>

<111>

 N,P

Features and Applications

FZ

Features

High voltage

High current

Application

High-voltage electric power

Microelectronic devices

Frequency converters, voltage regulators, etc

Picture Name
FZ

CZ

Heavy
Doping

Features

Energy

efficient

Application

Power switches

High frequency

Optical sensors

Image sensors, etc

Picture Name
CZ

MCZ

Light
Doping

Features

High storage density

High-performance computing

Low power consumption

Application

Memory chips

Analog chips

Logic chips, etc

Picture Name
MCZ